The program for the next Active & Intelligent Packaging World Congress & Hackathon is taking shape and already includes some of the leading exponents of the latest Active & Intelligent Packaging technologies and innovations. A line-up of speakers and exhibitors, including names from Agfa to Zappar, will ensure what is trending in the minds of Brand Owners and Retailers will be on the agenda.
With one Hackathon already confirmed, on ‘The Acceptance of Nanotechnology’ for packaging materials which extend shelf life of food, the Association confirms other Hackathon topics are at an advanced stage. Dick de Koning, AIPIA President confirmed, “These Hackathons will be a very dynamic part of the Congress. But, of course, there will be much more for delegates, as the program now on line on the AIPIA website demonstrates. The Association always delivers a very comprehensive overview of the state-of-the-art in Active & Intelligent Packaging – a full alphabet you might say!”
Thirty six speakers already lined up, including Udo Panenka, CEO of Esko Packaging who will tell FMCG companies how their packaging process needs to build more ‘muscle’ and how to do that! Richard Sharp, chief technology officer of Shazam will explain how the company’s music app technology has been adapted to offer a new customer experience from packaging and how Big Brands are using it.
Augmented Reality (AR) is the theme of Martin Stahel, sales director of Zappar. He will tell delegates how brands are using AR to make their packaging interactive. While Fabrice Digonnet, new business development leader EMEA for Dow Europe will address 5 technologies – in 5 minutes each – to end up with sustainable and cost-efficient smart packaging. Interesting!
Commenting on the Congress program so far, AIPIA executive director Eef de Ferrante said, “Its full of smart and fresh ideas from some of the best innovators in the business. We also have a very healthy slice of new active packaging developments, as well as an interesting take on how this technology is being implemented in Japan. That perspective will offer a valuable window into the whole Asian region for Active and Intelligent Packaging – where it is predicted to grow the fastest in the next decade.”
